Due to the concerns over the availability and increasing cost of DDR, AMD has developed a method for operating DDR2 memory with the processor’s memory controller. This application note details the software changes necessary to enable this technology. Note: The solution described in this document does not conform to the JEDEC DDR2 Specification. This solution may not work with all DDR2 memory. Note: This is revision B of this document. The change from revision A (also dated March 2009) is “AMD Co

Resolution Status. Fix planned for a future revision. Preliminary Information AMD Athlon™ Processor Model 6 Revision Guide 24332E—December 2002 17 Deadlock May Occur in a Two-Processor System in the Presence of Probe to Memory- Mapped I/O Products Affected. A0, A2, A5 Normal Specified Operation. Processor should not hang. Non-conformance. In a multiprocessor system, if one processor (A) is continuously writing to a cacheable memory-mapped I/O block while the other processor (B) is trying to read

• Disable the L1 cache. • Set up a channel of the 8254 Timer chip to count for a predetermined amount of time. • Read the CPU RTSC and save the initial count value. • Poll counter and wait for it to roll over. • Read the CPU RTSC and save as the final count. • Subtract the initial value of the RTSC from the final value. • EDX:EAX now contains the number of clock ticks in the predetermined amount of time. To get the value in MHz, divide the number of clocks by the time represented in microseconds

By using these guidelines you will products and affinity with your audiences. The following pages offer resources packaging and marketing materials that effectively align with CrossFire. Please use this guide to benefit expand the reach of your marketing Summary of All Products Belonging to the AMD CrossFire™ Series Chipset The list below summarizes the CrossFire™ Chipset product offering for the AMD platform BRAND NAMESASIC VariantPlatformChipsetRD480DTAMD 480XRD550DTAMD 550XRD580DTAMD 580XA M

Please follow these guidelines for all motherboard packaging with the AMD CrossFirechipset product line. Packaging Guidelines Mandatory Box Layout Requirements:There is only one mandatory element for all partner The AMD CrossFireChipset product logo MUST be on the front and back panels of the retail box.This elements must be reproduced without variation in the positions identified. Partner artwork can then be placed in grey zones of the marked illustration below. Packaging Guidelines Other Manda

NOTICE SYMBOL Registered marks notice symbol. All product and product feature names is claiming trademark rights or for which application should “™” notice symbol. the Chipset Marketing to ensure you Logos and Text Treatment Using AMD CrossFireChipset Logos Use AMD CrossFireChipset logos when promoting motherboards or systems with these chipset. The logos must be used in the following applications: • On the heat sink for Northbridge. • On the PC boot up screen (BIOS Splash) • On retail packaging

1077(a) Responsible Party Name: G.B.T. INC. Address: 18305 Valley Blvd., Suite#A LA Puent, CA 91744 Phone/Fax No: (818) 854-9338/ (818) 854-9339 hereby declares that the product Product Name: Mother Board Model Number: GA-7ZMMC Conforms to the following specifications: FCC Part 15, Subpart B, Section 15.107(a) and Section 15.109(a), Class B Digital Device Supplementary Information: This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This d

All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completenessof the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publicatio