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All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completenessof the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publicatio

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(Default value) Disabled Disable onboard 1st channel IDE port. OnChip SATA Controller Enabled Enable onboard SATA function. (Default value) Disabled Disable onboard SATA function. OnChip SATA Type Native IDE Set the SATA channel to Native IDE mode.(Default value) RAID Set the SATA channel to RAID mode. Legacy IDE Set the SATA channel to Legacy IDE mode. SATA..AHCI Set the SATA channel to AHCI mode. Advanced Host Controller Interface (AHCI) is an interface specification that allows the storage dr

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1.00 Contents Safety Information..........................................................................................................4 Technical Support............................................................................................................5 Conventions Used in This Guide....................................................................................5 Packing List.........................................................................................................

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To connect an AC97 front panel audio module to this connector, please refer to the instructions on Page 76 about the software settings. HD Audio: AC'97 Audio: 2 1 10 9 Pin No. Definition 1 MIC 2 GND 3 MIC Power 4 NC 5 Line Out (R) 6 NC 7 NC 8 No Pin 9 Line Out (L) 10 NC Pin No. Definition 1 MIC2_L 2 GND 3 MIC2_R 4 -ACZ_DET 5 LINE2_R 6 FSENSE1 7 FAUDIO_JD 8 No Pin 9 LINE2_L 10 FSENSE2 GA-M61P-S3 Motherboard - 24 - English 11) CD_IN (CD In Connector) Connect CD-ROM or DVD-ROM audio out to the conn

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37 B.1 BIOS Auto Flash Tool................................................................37 B.2 Flash Method..............................................................................37 Appendix C ............................................. 38 Appendix D ....................................... 42 -4- LE-366 User’s Manual (The Page is Left For Blank) -5- LE-366 User’s Manual Chapter 1 1.1 LE-366 is the Mini-ITX mothe

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NOTICE SYMBOL Registered marks notice symbol. All product and product feature names is claiming trademark rights or for which application should “™” notice symbol. the Chipset Marketing to ensure you Logos and Text Treatment Using AMD CrossFireChipset Logos Use AMD CrossFireChipset logos when promoting motherboards or systems with these chipset. The logos must be used in the following applications: • On the heat sink for Northbridge. • On the PC boot up screen (BIOS Splash) • On retail packaging

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Because the processor-mounting surface extends above the surface of the cam box on the socket, the heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm, centered over the processor. Figure 11 shows the measured thermal performance vs. flow rate for this heat sink. This data represents the expected performance of this heat sink on a dual-core socket F (1207) processor. Based Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev. 3.02 August 2006 Ther

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15 RSVD Reserved. 14:8 VID_FF_ THRESH Video FIFO Threshold. Watermark level for setting the video FIFO threshold. This value also determines when the secondary priority is used during a write request. If the FIFO WORD count exceeds this value, the secondary priority ID is used. An INT or SMI can also be generated if this threshold is exceeded. Threshold value. 0-127 Linear mode: Y buffer depth is 192 QWORDs. Planar mode: Y,U,V buffer depths are all 64 QWORDs 7:5 SYNC_TO_PIN Sync Select. Selects

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Based on the AMD Geode GX533 processor, the board provides many advanced features for reduced power consumption, fanless design and high cost/price rate of production. Low Power Consumption Based on the AMD Geode GX533@400MHz processor onboard, it only takes up to 8.4W at maximum powering, and is completely suitable for fanless design. Without any cooling fan onboard, it can avoid the heat problem when the cooler failed in accidence. Onboard TTL/LVDS LCD interface Based on the AMD Geode GX533@40

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1.0 MB Dimension 170mm x 148mm Operating System Windows® XP/ Vista/ Win7 Release Date 091229 Mainboard Things You Have To Know • The images and pictures in this manual are for reference only and may vary from the product you received depending on specific hardware models, third party components and software versions. • This mainboard contains very delicate IC chips. Always use a grounded wrist strap when working with the system. • Do not touch any IC chip, lead, connector or other components. •





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