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ULTRAMIC 600 heaters are constructed of aluminum nitride (AIN) and incorporate a thermally matched proprietary heating element that provides maximum performance in challenging applications. AIN is especially suitable for applications requiring a clean, non-contaminating heat source. Additionally, the excellent geometric stability ensures consistent part-to-part thermal contact during heating cycles. Watlow AIN heaters can operate up to 600°C with an ultrafast ramp rate of up to 150°C per second depending on the application, heater design and process parameters. In addition to excellent thermal characteristics, the ULTRAMIC 600 has high electrical isolation and typically provides superior chemical resistance as compared to traditional metal heaters. Robust AlN ceramic • Creates a homogeneous assembly for atmospheric and vacuum applications • Provides durable heater construction and thermal transfer necessary for high temperature and long heater life • Permits the design of a high watt density, fast responding, heater in a very small package • Geometrically stable due to low coefficient of thermal expansion (CTE) • Process temperatures up to 600°C (1112°F) depending on application parameters Rapid prototyping • Finite Element Analysis (FEA) provides rapid ‘virtual’ prototyping of heater performance prior to the manufacturing process • Custom prototypes can be delivered in weeks rather than months with innovative design and manufacturing practices Superior electrical performance • Low leakage current; <10 .A at 100°C • Breakdown voltage; >2000VI(dc) High thermal conductivity • Makes for a fast temperature ramp rate of up to 150°C (270°F) per second (depending on application parameters) • Allows for quick cool-down • Provides extremely uniform temperatures over the heater surface UL® is a registered trademark of Underwriter’s Laboratories, Inc. Thermocouple integrated into assembly (patent pending) • Bonded assembly process ensures reliability of heater/sensor interface • Optimized temperature sensing improves accuracy • High response rate in ramping applications UL® agency compliance (pending) • Designed to meet global safety standards Ramp rates to 150°C per second ULTRAMIC™ 600 Temperature Ramping Capabilities ULTRAMIC 600 temperature ramp rate as a function of watt density. Test completed using Watlow’s SERIES F4 temperature controller. Application Examples Semiconductor Equipment Eutectic die bonding equipment is used in the attachment of lead wires to the die before packaging of the IC. Optimum bonding is achieved by ramping the solder and lead temperature through the eutectic state. Watlow’s ULTRAMIC 600 heater is ideal for this application because a temperature ramp of up to 150°C/second can be achieved while also achieving a fast cool down in preparation for processing the next device. • Temperature ramp rate to 150°C (270°F)/sec • Vacuum holes and grooves • Surface flatness 0.05 mm (0.002 in.) • Surface finish <0.8 .m (32 .-in.) Analytical Instrumentation Mass spectrometers are used to determine the presence of trace chemicals in industrial, environmental and clinical applications. With detection capabilities into the part-per-trillion levels, cleanliness is of paramount concern. For use with ion sources, the chemical compatibility, low porosity and fine surface finish make the ULTRAMIC 600 an excellent choice where contamination of the sample is of concern. • Process temperatures to 600°C (1112°F) • Chemical compatibility • High dielectric strength • Small size and light weight • Ultra-fast temperature response • Operating temperatures up to 600°C • Thermal uniformity • Excellent chemical compatibility • Geometrically stable • High dielectric strength • Customized design Why ULTRAMIC 600? Configurations and Dimensions Maximum Dimensions 4032 mm2 (6.25 in2) Length Width Thickness Aspect Ratio Flat Square Min: 8 mm (0.314 in.) Max: 63.5 mm (2.5 in.) Min: 2 mm (0.078 in.) Max: 5 mm (0.196 in.) 1 Rectangular Max: 100 mm (3.94 in.) Min: 8 mm (0.157 in.) Min: 2 mm (0.078 in.) Max: 5 mm (0.196 in.) <10 Inside Diameter (I.D.) Outside Diameter (O.D.) Thickness Ring Wall Thickness Ring Min: 3 mm (0.118 in.) Max: O.D. 75 mm (2.95 in.) Min: 2 mm (0.078 in.) Max: 5 mm (0.196 in.) Minimum wall thickness: 3 mm (0.118 in.) Surface Finish Flatness Parallelism Surface Roughness (Ra) Straight Groove Custom Feature Hole Size Round Diameter <0.05 mm (0.002 in.) <0.05 mm (0.002 in.) <0.8 .m (32 .-in.) Depth: 0.20 - 0.5 mm (0.019 in.) Width: 0.75 - 2 mm (0.078 in.) Min: 1 mm (0.039 in.) Max: Outer edge 3 mm (0.118 in.) Electrical Properties Voltage Leakage Current Dielectric Constant Dielectric Strength 24 to 480V <0.1mA 8.9 15KV/mm Ramp Rate vs. Wattage Power density Maximum and minimum power densities can vary with voltage, surface area and application parameters. The following graph is meant as a guideline. Contact factory to determine optimum voltage and power for your application. Watt densities to 1000W/in2 Sintered ...