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Фрагмент инструкции
© Copyright 2005 Hewlett-Packard Development Company, L.P. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Bluetooth is a trademark owned by its proprietor and used by Hewlett-Packard Company under license. SD logo is a trademark of its proprietor. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Maintenance and Service Guide HP Compaq nx8220 and nc8230 Notebook PCs HP Compaq nw8240 Mobile Workstation First Edition March 2005 Document Part Number: 372658-001 Contents 1 Product Description 1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook. . . . . . . . . . . . . . . . . . . . . . . 1–5 1.3 Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4 External Components . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.5 Design Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20 2 Troubleshooting 2.1 Computer Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1 2.2 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . . 2–7 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Notebook Major Components. . . . . . . . . . . . . . . . . . 3–2 3.3 Miscellaneous Plastics Kit . . . . . . . . . . . . . . . . . . . 3–14 3.4 Miscellaneous Cable Kit. . . . . . . . . . . . . . . . . . . . . 3–15 3.5 Mass Storage Devices. . . . . . . . . . . . . . . . . . . . . . . 3–16 3.6 Miscellaneous (Not Illustrated). . . . . . . . . . . . . . . . 3–17 3.7 Sequential Part Number Listing. . . . . . . . . . . . . . . 3–19 4 Removal and Replacement Preliminaries 4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.3 Preventing Damage to Removable Drives . . . . . . . . 4–3 4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4 4.5 Packaging and Transporting Precautions . . . . . . . . . 4–5 4.6 Workstation Precautions. . . . . . . . . . . . . . . . . . . . . . 4–6 4.7 Grounding Equipment and Methods . . . . . . . . . . . . . 4–7 Maintenance and Service Guide Contents 5 Removal and Replacement Procedures 5.1 Serial Number. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3 5.3 Preparing the Notebook for Disassembly . . . . . . . . . 5–5 5.4 Hard Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.5 Notebook Feet. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10 5.6 MultiBay II Device. . . . . . . . . . . . . . . . . . . . . . . . . 5–11 5.7 External Memory Module. . . . . . . . . . . . . . . . . . . . 5–12 5.8 Bluetooth Board . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15 5.9 Keyboard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17 5.10 Switch Cover. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–22 5.11 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–26 5.12 Thermal Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27 5.13 Heat Sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–29 5.14 Processor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–32 5.15 TPM Security Card. . . . . . . . . . . . . . . . . . . . . . . . 5–34 5.16 Internal Memory Module . . . . . . . . . . . . . . . . . . . 5–35 5.17 TouchPad. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–37 5.18 Mini PCI Communications Card. . . . . . . . . . . . . . 5–40 5.19 Display Assembly. . . . . . . . . . . . . . . . . . . . . . . . . 5–42 5.20 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–46 5.21 Modem Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–50 5.22 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–52 5.23 System Board Frame. . . . . . . . . . . . . . . . . . . . . . . 5–59 5.24 Push Button Module . . . . . . . . . . . . . . . . . . . . . . . 5–63 5.25 Serial Connector Module . . . . . . . . . . . . . . . . . . . 5–65 5.26 Audio Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–67 6 Specifications A Connector Pin Assignments B Power Cord Set Requirements C Screw Listing Index Maintenance and Service Guide 1 Product Description The HP Compaq nx8220 and nc8230 Notebook PCs and HP Compaq nw8240 Mobile Workstation offer advanced modularity, Intel® Pentium® M processors, an...
Эта инструкция также подходит к моделям:Компьютеры - NW8240 (2.72 mb)
Компьютеры - NX8220 (2.72 mb)