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Фрагмент инструкции
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Processor Type Intel® Core™ i7-870 Intel Core i7-860 Intel Core i7-750 Intel Core i5-670 Intel Core i5-661 Intel Core i5-660 Intel Core i5-650 Intel Core i3-540 Intel Core i3-530 L1 cache 32 KB L2 cache 256 KB/core Processor (continued) L3 cache Intel Core i5-670 upto 4 MB Intel Core i5-661 Intel Core i5-660 Intel Core i5-650 Intel Core i3-540 Intel Core i3-530 Intel Core i7-750 upto 6 MB Intel Core i7-870 upto 8 MB Intel Core i7-860 Memory Connectors four internally-accessible DDR3 DIMM sockets Capacities 1 GB, 2 GB, and 4 GB Memory type 1066-MHz or 1333-MHz DDR3 DIMM; non-ECC memory only Memory configurations possible 4 GB, 6 GB, 8 GB, 12 GB, and 16 GB (64-bit operating system) Computer Information System chipset Intel H57 Data bus width 2.5 GT/s DRAM bus width 64 bits Processor address bus width 64 bits RAID support (internal SATA drives RAID 0 (striping) only) RAID 1 (mirroring) BIOS chip (NVRAM) 8 MB Memory speed 1333 Mhz Drives and Devices Externally accessible • two 5.25-inch bays for SATA DVD+/-RW Super Multi Drive or Blu-ray Disc™ combo or Blu-ray Disc RW drive Internally accessible Wireless (optional) two 3.5-inch bays for SATA hard drives WiFi/Bluetooth® wireless technology Expansion Bus PCI Express • Gen2 x1 slot bi-directional speed — 500 MB/s • Gen2 x16 slot bi-directional speed — 16 GB/s PCI 32-bit speed — 33 MHz SATA 2.0 1.5 Gbps and 3.0 Gbps USB 2.0 • high speed — 480 Mbps • full speed — 12 Mbps • low speed — 1.2 Mbps Memory Card Reader Cards supported • CompactFlash (CF) card • Smart Media (SM) card •xD-Picture (xD) card • Memory Stick (MS) card • Memory Stick Duo card • Memory Stick PRO Duo card • Memory Stick PRO (MSPRO) card •Memory Stick PRO HG (MSPRO HG) card • SecureDigital (SD) card • SecureDigital Card (SDHC) 2.0 • MultiMedia Card (MMC) •MicroDrive (MD) Video Integrated Intel® Graphics Media Accelerator HD Discrete PCI Express x16 card Audio Type Integrated 7.1 channel, High Definition audio with S/PDIF support System Board Connectors Memory four 240-pin connectors PCI one 124-pin connector PCI Express x1 two 36-pin connectors PCI Express x16 one 164-pin connector Power (system board) one 24-pin EPS 12V connector (ATX-compatible) Processor fan one 4-pin connector System Board Connectors (continued) Chassis fan one 3-pin connector Front USB connector five 9-pin connectors Front audio connector one 9-pin connector for 2-channel stereo sound and microphone SATA four 7-pin connectors S/PDIF out one 5-pin connector External Connectors Network adapter RJ45 connector USB two top-panel, two front-panel, and four back-panel USB 2.0-compliant connectors Audio top panel — one headphone and one microphone connector back panel — six connectors for 7.1 support S/PDIF one S/PDIF (optical) connector eSATA one back-panel connector IEEE 1394a one back-panel 6-pin serial connector HDMI 19-pin connector DVI 24-pin connector Expansion Slots PCI Connectors one Connector size 124-pin connector Connector data width (maximum) 32 bit PCI Express x1 Connectors two Connector size 36-pin connector Expansion Slots (continued) Connector data width (maximum) PCI Express x16 Connectors 1 PCI Express lane one Connector size Connector data width (maximum) 164-pin connector 16 PCI Express lane Power DC Power Supply Wattage 350 W Maximum heat dissipation 1836 BTU/hr NOTE: Heat dissipation is calculated by using the power supply wattage rating. Input voltage 115/230 VAC Input frequency 50/60 Hz Rated output current 8 A/4 A Battery Coin-cell battery 3-V CR2032 lithium coin cell Physical Height 407.75 mm (16.02 inches) Width 185.81 mm (7.31 inches) Depth 454.67 mm (17.90 inches) Weight 10.18 kg (22.40 lb) Computer Environment Temperature range: Operating 10°C to 35°C (50°F to 95°F) Storage -40°C to 65°C (-40°F to 149°F) Relative humidity 20% to 80% (non-condensing) Computer Environment (continued) Maximum vibration (using a random-vibration spectrum that simulates user environment): Operating 0.25 GRMS Storage 2.2 GRMS Maximum shock (measured with hard drive in head-parked position and a 2-ms half-sine pulse): Operating Half-Sine Pulse: 40G for 2 ms with a change in velocity of 20 in/s (51 cm/s) Storage Half-Sine Pulse: 50G for 26 ms with a change in velocity of 320 in/s (813 cm/s) Altitude (maximum): Operating -15.2 to 3048 m (-50 to 10,000 ft) Storage -15.2 to 10,668 m (-50 to 35,000 ft) Airborne contaminant level G2 or lower as defined by ISA-S71.041985 Information in this document is subject to change without notice. © 2009 Dell Inc. All rights reserved. Reproduction of these materials in any manner whatsoever without the written permission of Dell Inc. is strictly forbidden. Trademarks used in this text: Dell, the DELL logo, Studio XPS are trademarks of Dell Inc.; Intel is a registered trademark and Core is a trademark of ...