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Fig.8 IP as a function of VP. 0 300 200 100 0 4 VP (V) IP (mA) 208 12 16 MGD921 MGD922 60 Po (W) 40 20 0 (1) (2) (3) 8 1012141618 VP (V) (1) (2) (3) EIAJ. 10%. 0.5%. Fig.9 Po as a function of VP. Fig.10 THD + N as a function of Po. 10 1 Po (W) 10-1 10-2 MGD923 10 102 103 104 105 THD+N (%) 1 kHz f = 10 kHz 100 Hz Fig.11 THD + N as a function of frequency. 10 1 f (Hz) 10-1 10-2 MGD924 10 102 103 104 105 THD+N (%) 10 W 1 W 1998 Sep 23 11 Philips Semiconductors Product specification Philips Semiconductors Product specification TDA8567Q amplifier Fig.12 SVRR as a function of frequency. -90 -70 -50 -30 MGD925 10 f (Hz) SVRR (dB) 102 103 104 105 MGD926 -30 acs (dB) -50 -70 -90 10 102 103 104 105 (1) (2) f (Hz) (1) channel 1 U channel 2, channel 3 U channel 4. (2) channels 1 and 2 U channels 3 and 4. Fig.13 Channel separation as a function of frequency. 1998 Sep 23 12 Philips Semiconductors Product specification Philips Semiconductors Product specification TDA8567Q amplifier PCB layout Fig.14 PCB layout (component side). MGK079 Pgnd 2200 mF 100 nF 470 nF 10 kW diag in 1 2 3 4 in mode out 4 out 3 sgnd 470 nF out1 out2 VP - + - + - + - + - 78.74 111.76 Dimensions in mm. 1998 Sep 23 13 Philips Semiconductors Product specification Philips Semiconductors Product specification TDA8567Q amplifier Fig.15 PCB layout (soldering side). MGK080 Pgnd 2200 mF100nF 470 nF 10 kW diagin 1234 inmode out 4 out 3 sgnd 470 nF out1 out2 VP - + - + - + - + - 78.74 111.76 Dimensions in mm. 1998 Sep 23 14 Philips Semiconductors 4 . 25 W BTL quad car radio power amplifier Philips Semiconductors 4 . 25 W BTL quad car radio power amplifier PACKAGE OUTLINE DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) SOT411-1 UNIT A2 REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 4.6 4.3 A4 1.15 0.85 A5 1.65 1.35 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT411-1 96-10-11 98-02-20 0 5 10 mm scale D L L1 L2 E2 E c A4 A5 A2 m L3 E1 Q w M bp 1 d Z e 2ee 1 23 j v M Dx h Eh non-concave view B: mounting base side B b e 1bp c D(1) E(1) Z(1)d eDh L L3 m 0.75 0.60 0.55 0.35 30.4 29.9 28.0 27.5 12 2.5412.2 11.8 10.15 9.851.27 e 2 5.08 2.4 1.6 Eh 6 E1 14.0 13.0 L 1 10.7 9.9 L 2 6.2 5.8 E2 1.43 0.78 2.1 1.8 1.85 1.65 4.33.6 2.8 Qj 0.25 w 0.6 v 0.03 x 45° b 1998 Sep 23 15 Philips Semiconductors Philips Semiconductors 4 . 25 W BTL quad car radio power amplifier TDA8567Q SOLDERING The device may be mounted up to the seating plane, but Introduction the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the through-hole and surface mounted components are mixed temperature within the permissible limit. on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for Repairing soldered joints printed-circuits with high population densities. In these situations reflow soldering is often used. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not This text gives a very brief insight to a complex technology. more than 2 mm above it. If the temperature of the A more in-depth account of soldering ICs can be found in soldering iron bit is less than 300 °C it may remain in our “DataHandbook IC26; Integrated Circuit Packages” contact for up to 10 seconds. If the bit temperature is (order code 9398 652 90011). between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use...